12W/mK High Thermal Conductivity Pad, Low Thermal Resistance, UL RoHS No Leakage for Server High-power Electronics
Product Specification
12W/mK high-performance thermal pad is the top-grade thermal interface material in our product line, specially developed for high-power density electronic equipment with extreme heat dissipation demands. Breaking through conventional thermal conductivity limits, this pad reaches a maximum thermal conductivity of 12W/mK, delivering ultra-low thermal resistance and rapid heat transfer efficiency to solve thermal throttling and overheating failure of high-power chips. Adopting high-density thermally conductive filler and imported silicone matrix, the material achieves perfect balance between ultra-high thermal performance and structural stability.
Products details
It maintains stable heat conduction efficiency in the range of -40℃ to 200℃, resisting thermal fatigue and performance attenuation under long-term high-load and high-frequency temperature cycling. The soft and highly compressible structure can fit tightly with high-density chip surfaces and cold plates, filling micro gaps thoroughly to eliminate heat transfer dead zones. The upgraded low-volatility formula completely avoids silicone oil leakage and siloxane precipitation, protecting high-precision server and communication equipment from contamination damage. All products comply with UL flame retardant and RoHS environmental standards, with excellent electrical insulation to prevent short circuits in high-density circuit layouts. We support exclusive customization of ultra-thin thickness, special-shaped die-cut and back adhesive, adapting to miniaturized and high-precision assembly requirements of high-end electronic equipment. It is the optimal thermal solution for high-power and high-heat industrial scenarios.
Technical Parameters
|
Parameter Item
|
Specification
|
Test Standard
|
|
Max Thermal Conductivity
|
12W/m·K
|
ASTM D5470
|
|
Thermal Resistance
|
Ultra-low Thermal Resistance
|
Professional Thermal Test
|
|
Working Temperature Range
|
-40℃ ~ 200℃
|
Full-cycle Aging Test
|
|
Leakage Performance
|
Zero Silicone Oil Precipitation
|
High-temperature Endurance Test
|
|
Safety Certification
|
UL Flame Retardant, RoHS
|
International Safety Standard
|
|
Custom Service
|
Ultra-thin & Special Die-cut Available
|
High-precision Customization
|
Application Scenarios
12W/mK high thermal conductivity pad is exclusively used for high-power density heat dissipation scenarios, including AI servers, GPU graphics cards, high-performance computing equipment, industrial high-power modules and 5G radio frequency base stations. It effectively solves the heat dissipation bottleneck of high-power chips, avoids equipment performance reduction and crash caused by overheating, and improves the stability and operation efficiency of high-end electronic equipment. The pollution-free and high-reliability features meet the long-term stable operation requirements of high-precision industrial equipment, and are the preferred high-end thermal management material for European and American high-tech electronic manufacturing enterprises.
