The ultra-soft and high-flexibility material design can produce micro-compression deformation under slight assembly pressure, fully filling the micro gaps on the surface of precision chips and circuit boards, eliminating air thermal resistance and achieving efficient and uniform heat dissipation. Compared with thermal grease, the solid ultra-thin thermal pad has no oil overflow, no particle pollution, will not cause short circuit or contamination damage to precision electronic circuits, and greatly improves the yield rate of precision electronic products. It supports personalized customization of thickness, size, shape and hardness, and can be precisely die-cut into various special shapes according to customer drawings, fully adapting to the structural design of miniaturized electronic equipment. The material has low assembly stress, will not cause extrusion damage to fragile precision chips and components, and is very suitable for automated high-precision assembly lines in European and American electronic factories.