This low-stress self-adhesive thermal pad is widely used in miniaturized high-precision electronic equipment and automated production scenarios, including wearable electronic devices, notebook precision modules, 5G miniature communication modules, precision sensors, medical electronic equipment and automotive precision control units. The low-stress and ultra-clean features protect fragile precision components, while the self-adhesive design improves assembly efficiency and reduces manual errors. Custom ultra-thin and special-shaped processing adapts to compact equipment structural design, ensuring stable heat dissipation and long-term reliable operation of high-precision electronic products, which is widely favored by European and American precision electronic manufacturing enterprises.