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 » Thermal Silicone Pad, High Thermal Conductivity Gap Pad for Electronics Cooling
Thermal Silicone Pad, High Thermal Conductivity Gap Pad for Electronics Cooling

Product Specification

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Products details

What is Thermal Gel

Two‑component thermal gel is a dispensable thermal interface material. After mixing part A and part B, it cures at room temperature without baking. It fills gaps between heat‑generating chips and heat sinks, delivering stable thermal conductivity while keeping insulation property.

Main Advantages

  • ✅ Two‑component mixing, room‑temperature curing
  • ✅ Soft gel status after curing, low stress to components
  • ✅ No need for pressure, good gap‑filling performance
  • ✅ Thermal conductivity: 1.5‑6.0 W/mK available
  • ✅ Pumpable & dispensable for automatic dispensing machine
  • ✅ Support custom formula & OEM service

Application Fields

Perfect for new‑energy battery packs, power supplies, automotive electronics, communication equipment, PCB mainboard and industrial control modules.

Our Supply

We provide standard two‑component thermal gel. Samples can be arranged for customer performance testing. Please contact us for datasheet and factory quotation.

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