Low-stress self-adhesive precision thermal pad is developed for miniaturized high-precision electronic equipment and automated assembly production lines. With full thermal conductivity options from 0.8W/mK to 12W/mK, it can meet the precise heat dissipation requirements of low-power sensors and high-performance precision chips. The material adopts ultra-soft low-stress silicone formula, which will not produce extrusion damage to fragile precision chips, PCB boards and micro-components during assembly, greatly improving the yield rate of precision electronic products. Equipped with optional single-sided and double-sided self-adhesive layers, it features easy lamination, firm fitting and no degumming after long-term temperature cycling, perfectly adapting to high-speed automated assembly lines. It maintains stable performance in the wide temperature range of -40℃ to 200℃, without warping, shrinkage or thermal performance drift. The upgraded zero-leakage formula avoids silicone oil precipitation and circuit pollution, ensuring the long-term cleanliness and stability of precision electronic systems. Excellent surface compliance can fill micro gaps of uneven precision component surfaces, eliminate air thermal resistance, and achieve uniform and efficient heat dissipation. All products pass UL safety and RoHS environmental certification, with reliable insulation and flame retardant properties. We support ultra-thin thickness customization and arbitrary special-shaped die-cutting, fully matching the compact structural design of wearable devices, communication modules and precision sensing equipment.