Our thermal gel is soft self-leveling gap filler material, 3.0~8.0W/m·K thermal conductivity, no curing, good compressibility for EV battery, PCB and power module gap heat dissipation, available in jar & bulk packing.
• Thermal conductivity:3.0~8.0W/m·K
• Temp range:-45℃ ~ +180℃
• Feature:Self-leveling, soft compressible, non-curing
• Package:Jar / bulk barrel customized