12W/mK high thermal conductivity pad is exclusively used for high-power density heat dissipation scenarios, including AI servers, GPU graphics cards, high-performance computing equipment, industrial high-power modules and 5G radio frequency base stations. It effectively solves the heat dissipation bottleneck of high-power chips, avoids equipment performance reduction and crash caused by overheating, and improves the stability and operation efficiency of high-end electronic equipment. The pollution-free and high-reliability features meet the long-term stable operation requirements of high-precision industrial equipment, and are the preferred high-end thermal management material for European and American high-tech electronic manufacturing enterprises.