Product Specification
Product Specification
High-performance 6W/m·K thermal silicone pads for electronics cooling. RoHS-compliant, non-conductive, and available in custom sizes. Perfect for CPU, GPU, LED, and industrial heat dissipation.
Products details
Self-adhesive compressible thermal pad is designed for power semiconductor thermal interface, widely used on IGBT modules, thyristors and industrial inverter equipment. Many power semiconductors are fragile under high clamping force; our ultra-soft thermal pad features high compressibility to reduce mechanical stress applied on chips during assembly.
This thermal pad comes with single-side or double-side self-adhesive option, no extra adhesive needed. It will not delaminate under thermal cycling. Multiple thermal conductivity grades from 2W/mK to 10W/mK, thickness from 0.5mm to 8mm to match different assembly gaps. High dielectric strength guarantees safe isolation between power circuit and heat sink.
Unlike hard thermal sheets, this pad can deform moderately under pressure to eliminate air voids between IGBT and heat sink. It retains elasticity after long compression and will not permanently creep. It passes vibration and thermal cycle test for industrial inverter applications.
Thermal Material Pro provides pre-cut pads for power module manufacturers. We can adjust hardness, tack level and thickness according to your power module drawing. Free samples are available for reliability testing. Proper thermal pad selection stabilizes working temperature of IGBT modules, reduces thermal fatigue and extends service life of frequency converters and industrial power equipment. Contact our thermal engineer to get your custom sol
