12W/mK High Thermal Conductivity Pad Low Thermal Resistance UL RoHS No Leakage for Server High-power Electronics
Product Specification
12W/mK high-performance thermal pad is the top-grade thermal interface material in our product line, specially developed for high-power density electronic equipment with extreme heat dissipation demands. Breaking through conventional thermal conductivity limits, this pad reaches a maximum thermal conductivity of 12W/mK, delivering ultra-low thermal resistance and rapid heat transfer efficiency to solve thermal throttling and overheating failure of high-power chips
Products details
Technical Parameters
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Parameter Item
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Specification
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Test Standard
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Max Thermal Conductivity
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12W/m·K
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ASTM D5470
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Thermal Resistance
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Ultra-low Thermal Resistance
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Professional Thermal Test
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Working Temperature Range
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-40℃ ~ 200℃
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Full-cycle Aging Test
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Leakage Performance
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Zero Silicone Oil Precipitation
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High-temperature Endurance Test
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Safety Certification
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UL Flame Retardant, RoHS
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International Safety Standard
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Custom Service
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Ultra-thin & Special Die-cut Available
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High-precision Customization
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Application Scenarios
12W/mK high thermal conductivity pad is exclusively used for high-power density heat dissipation scenarios, including AI servers, GPU graphics cards, high-performance computing equipment, industrial high-power modules and 5G radio frequency base stations. It effectively solves the heat dissipation bottleneck of high-power chips, avoids equipment performance reduction and crash caused by overheating, and improves the stability and operation efficiency of high-end electronic equipment. The pollution-free and high-reliability features meet the long-term stable operation requirements of high-precision industrial equipment, and are the preferred high-end thermal management material for European and American high-tech electronic manufacturing enterprises.
