No Oil Leakage Custom Die-cut for General Electronics Cooling Thermal Pad
Product Specification
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Specification
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Test Standard
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TSP-6, 6W/m·K
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ASTM D5470
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-40℃ ~ 200℃
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Long-term Load Aging Test
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High Compression Resistance, Low Deformation
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ASTM D575
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No Silicone Oil Bleeding
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1000h High-temp Test
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High Withstand Voltage Insulation
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ASTM D149
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UL, RoHS Certified
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International Industrial Standard
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Products details
Application Scenarios
The stable 6W/mK thermal conductivity perfectly matches the heat generation of medium-power power components, effectively reducing operating temperature and extending equipment service life. The no-leakage and high-insulation characteristics adapt to long-term 24/7 operation of industrial power equipment, greatly reducing failure rate. Custom die-cut and back adhesive services support standardized and modular assembly, widely recognized by European and American power equipment manufacturers as a benchmark thermal pad for power industry thermal management.
Product Description
12W/mK high-performance thermal pad is the top-grade thermal interface material in our product line, specially developed for high-power density electronic equipment with extreme heat dissipation demands. Breaking through conventional thermal conductivity limits, this pad reaches a maximum thermal conductivity of 12W/mK, delivering ultra-low thermal resistance and rapid heat transfer efficiency to solve thermal throttling and overheating failure of high-power chips. Adopting high-density thermally conductive filler and imported silicone matrix, the material achieves perfect balance between ultra-high thermal performance and structural stability. It maintains stable heat conduction efficiency in the range of -40℃ to 200℃, resisting thermal fatigue and performance attenuation under long-term high-load and high-frequency temperature cycling.
