Low siloxane thermal gap pad is a premium thermal pad designed for 5G telecom base station, RF board and communication electronics. Siloxane volatile contamination may cause corrosion on radio frequency components and optical parts, so our low-siloxane thermal pad minimizes volatile release for high-reliability communication hardware.

This thin thermal pad is available from 0.2mm ultra-thin up to 5mm, thermal conductivity options from 1W/mK to 9W/mK. It provides stable heat transfer while maintaining good dielectric insulation for densely packed communication PCB assemblies. The pad has low oil bleed characteristic and keeps consistent thermal performance over thousands of thermal cycles.

It works reliably under outdoor station temperature swings, humidity and dust environment. Material meets REACH requirement, suitable for long term telecom field deployment. We provide roll stock, sheet and custom kiss-cut parts for telecom OEMs.

Thermal Material Pro’s low siloxane thermal pad is widely adopted for remote radio units and communication power boards. We can adjust hardness and surface tack to match your automated assembly line. Free samples for RF component thermal validation. Our thermal pad reduces hot spot on RF chips and amplifiers, maintaining stable signal performance and extending service life of outdoor 5G base station hardware. Send inquiry for technical specification and quotation.