Product Specification
Products details
Product Description
Stop Overheating in Power Supplies | UL94 V-0 Flame Retardant Thermal Pad
Power supply overheating is the number one cause of equipment failure, performance degradation, and shortened service life. When heat generated by high-power components cannot be efficiently conducted to the heat sink, hotspot temperatures rise sharply. In mild cases, this leads to system reboots and reduced efficiency; in severe cases, it can burn out core components, resulting in costly repairs and unplanned downtime.
Thermal Material Pro High Conductivity Silicone Thermal Pad is engineered specifically to solve this industry-wide pain point. As a high-performance Thermal Interface Material (TIM) , it is designed to fill the microscopic air gaps between heat-generating components (such as MOSFETs, transformers, and power ICs) and heat sinks or enclosures. By building a low thermal resistance conduction path, it rapidly transfers heat away from critical components, ensuring your power supply operates reliably within safe temperature limits.
Key Product Specifications:
| Parameter | Specification Range | Key Benefit |
| Thermal Conductivity | 1.0 ~ 10.0 W/m·K (Custom 0.8~12W/m·K available) | Flexible selection based on power density for optimal heat transfer |
| Operating Temperature | -40℃ ~ 200℃ | Withstands harsh industrial environments and thermal shock |
| Thickness Range | 0.2mm ~ 10mm (Customizable) | Effectively fills varying gap sizes for flexible design |
| Flame Retardant Rating | UL94 V-0 Compliant | Self-extinguishing properties provide critical safety protection |
| Certifications | RoHS & UL Certified | Environmentally friendly, meets global market access requirements |
| Long-term Reliability | Low oil bleed, excellent compression resistance | No contamination over extended use, minimal performance degradation |
