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 » Compressible Flexible Thermal Pad  1.0–10.0W/mK, -40~200℃ Gap Filling UL94 V-0 Custom Pad for Server  Power Electronics
Compressible Flexible Thermal Pad 1.0–10.0W/mK, -40~200℃ Gap Filling UL94 V-0 Custom Pad for Server Power Electronics

Product Specification

Application Scenarios

This flexible compressible thermal pad is widely used in equipment with irregular gaps and uneven heat dissipation surfaces, including AI servers, data center equipment, communication base station modules, industrial power cabinets, power inverters and household high-power electronic equipment. Its excellent gap-filling performance solves the heat dissipation bottleneck caused by assembly tolerance and uneven surface of components, stabilizes the operating temperature of high-power equipment, and reduces equipment failure rate. It is compatible with automated assembly lines, suitable for mass production and processing of European and American electronic manufacturers, and is a cost-effective and high-reliability universal thermal management solution.

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Products details

Product Description

Flexible compressible gap-filling thermal pad is designed for electronic equipment with uneven assembly surfaces and irregular heat dissipation gaps, focusing on solving the heat dissipation problem of non-flat contact surfaces and large tolerance gaps. Made of super elastic silicone substrate with high-purity thermally conductive fillers, this thermal pad has excellent compression and resilience performance, which can automatically adapt to uneven component surfaces and irregular assembly gaps after being stressed, completely eliminate air gaps between heat sources and heat sinks, and maximize heat transfer efficiency. It provides a complete thermal conductivity range of 1.0W/m·K to 10.0W/m·K, which can flexibly match the heat dissipation demands of low-power consumer electronics and high-power server and power equipment. The stable temperature resistance of -40℃ to 200℃ ensures that the material will not lose elasticity or attenuate thermal performance under long-term temperature cycle changes, maintaining consistent gap-filling and heat dissipation effects. The customizable thickness ranges from 0.2mm to 10mm, which can cover ultra-thin precise gaps and thick buffer gaps of various electronic equipment. All products meet UL94 V-0 flame retardant standards, with excellent fire safety performance, suitable for high-density indoor electronic equipment such as servers and power cabinets. The material has moderate hardness and super flexibility, low compression permanent deformation, can rebound quickly after pressure relief, and is suitable for long-term dynamic working conditions of equipment. It supports single-sided and double-sided adhesive customization, which is convenient for automatic mounting and fixing of assembly lines, greatly improving the efficiency of mass production. Different from rigid thermal materials, it will not cause extrusion damage to components, with high safety and strong compatibility. It has stable electrical insulation, effectively preventing circuit short circuits and leakage risks, and fully complies with EU RoHS and REACH environmental protection regulations, being safe and environmentally friendly for long-term use.

Technical Parameters

Parameter Item
Specification
Test Standard
Thermal Conductivity
1.0~10.0W/m·K
ASTM D5470
Effective Temp Range
-40℃ ~ 200℃
Full Temperature Cycle Test
Custom Thickness Scope
0.2mm ~ 10mm
Full-size Customization
Flame Retardant Standard
UL94 V-0
UL International Standard
Compression Resilience
High Resilience, Low Permanent Deformation
ASTM D575
Optional Process
Single/Double-sided Adhesive, Die-cut
Custom Processing
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