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 » High-power Electronics Thermal Conductivity Pad -40℃ ~ 200℃
High-power Electronics Thermal Conductivity Pad -40℃ ~ 200℃

Product Specification

protecting high-precision server and communication equipment from contamination damage. All products comply with UL flame retardant and RoHS environmental standards, with excellent electrical insulation to prevent short circuits in high-density circuit layouts. We support exclusive customization of ultra-thin thickness, special-shaped die-cut and back adhesive, adapting to miniaturized and high-precision assembly requirements of high-end electronic equipment. It is the optimal thermal solution for high-power and high-heat industrial scenarios.

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Products details

It effectively solves the heat dissipation bottleneck of high-power chips, avoids equipment performance reduction and crash caused by overheating, and improves the stability and operation efficiency of high-end electronic equipment. The pollution-free and high-reliability features meet the long-term stable operation requirements of high-precision industrial equipment, and are the preferred high-end thermal management material for European and American high-tech electronic manufacturing enterprises.

Technical Parameters

Working Temperature Range
-40℃ ~ 200℃
Full-cycle Aging Test
Leakage Performance
Zero Silicone Oil Precipitation
High-temperature Endurance Test
Safety Certification
UL Flame Retardant, RoHS
International Safety Standard
Custom Service
Ultra-thin & Special Die-cut Available
High-precision Customization
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