Heat flux density of AI chips approaches 600W/cm², making high-end thermal grease an essential necessity

With the rapid iteration of AI technology, the computing power of AI servers keeps rising. The power consumption of a single GPU has exceeded 1000W, and the chip heat flux density is close to 600W/cm². Traditional air cooling has nearly reached its performance limit, while liquid cooling has become the mainstream solution for intelligent computing centers. Against this backdrop, high-end thermal grease, as a core supporting material for heat dissipation systems, is witnessing explosive market demand growth.

Industry statistics show that global AI server shipments will surge by over 28% year-on-year in 2026, with the liquid cooling penetration rate of AI training servers hitting 74%. Newly-built intelligent computing centers are almost fully equipped with liquid cooling systems. Liquid cooling systems set stricter performance standards for thermal grease, which needs excellent thermal conductivity, low thermal resistance, high stability, anti-aging property and non-corrosiveness to ensure long-term stable operation of chips.

At present, leading domestic thermal grease manufacturers have developed dedicated high-end products for AI servers. These products feature thermal conductivity of 5-6W/(m·K) and thermal resistance as low as 0.01℃·in²/W. They can efficiently dissipate massive heat generated by chips, lower junction temperature, improve operational efficiency and service life of AI servers, and fuel the high-quality development of the AI computing power industry.